MacDermid Alpha Electronics Solutions Wafer Bumping Metallization solutions for Semiconductor Packaging MICROFAB ® SC-40

Product Overview The MICROFAB SC-40 is a high-speed copper plating process designed for copper pillars in flip chip packages, copper microbumps in 3D interconnect packages, and redistribution layers. It ensures accurate bump height uniformity and shape control. Engineered as a low-stress solution, the MICROFAB SC-40 process delivers flat bump shapes with excellent uniformity within the wafer, die, and features. It shares its lineage with MICROFAB SC but offers the added benefit of higher plating rates.