MacDermid Alpha Electronics Solutions Wafer Bumping Metallization solutions for Semiconductor Packaging MICROFAB ® GSW-200

Product Overview MICROFAB GSW-200 is a mid-purity plating system that works with or without a Ni barrier. Its ability to level pads reduces solder usage, lowering the cost of ownership. The process produces bright, fine-grained, ductile deposits with excellent physical properties. It enables complete via filling, minimizes surface deposition, reduces cycle time, and eliminates the need for planarization. This process supports stacked via constructions and enhances reliability for via-in-pad designs.