MacDermid Alpha Electronics Solutions High-Throw Direct Current Acid Copper Plating MacuSpec ™ HT 360

Product Overview MacuSpec HT 360 is a state-of-the-art Direct Current (DC) acid copper plating process that offers greater throwing power at current densities up to 35 ASF in through holes with aspect ratios up to 12:1. The increased throwing power and higher current density provide greater throughput while minimizing excess surface copper, helping to extend the capabilities of DC plating. Product Features Superior Production Capacity Unsurpassed production capacity for DC plating of multilayer boards with aspect ratios up to 12:1. Excellent Plating Performance MacuSpec HT 360 is capable of plating copper with exceptional brightness, ductility, and uniformity. Exceptional Microdistribution Excellent microdistribution at high current densities of up to 35 ASF. Featured Applications Mobile Devices MacuSpec HT 360 provides enhanced thermal reliability, ensuring dependable mobile device performance. Automotive MacuSpec HT 360 deposits surpass all IPC specifications for through-hole metallization in multilayer board production for advanced automotive applications.