MacDermid Alpha Electronics Solutions MICROFAB ® DVF-200

Acid copper plating process fills Through-Silicon Vias (TSVs) without voids or defects at high plating speeds. Product Overview MICROFAB DVF-200 is an acid copper plating process designed to fill Through-Silicon Vias (TSVs) without voids or other defects at high plating speeds. The process is specially formulated for vias with diameters ranging from 5 to 100 μm and aspect ratios of less than 10:1. Reduced Voids and Defects MICROFAB DVF-200 delivers exceptional bottom-up fill for Through-Silicon Vias. Versatile Solution MICROFAB DVF-200 is a versatile solution that exhibits ease of use for a variety of aspect ratios.