Dymax Dymax Ultra Light-Weld® 9008 UV Curing Encapsulant Clear 10 mL MR Syringe 9008/10SYMR

Description
DYMAX Ultra Light-Weld 9008 UV Curable Encapsulant is used for sealing and encapsulating electronic devices such as chip-on-flex or chip-on-board applications. It is flexible, solvent free, and moisture resistant. 10 mL MR Syringe.
Request a Quote Datasheet
Description
DYMAX Ultra Light-Weld 9008 UV Curable Encapsulant is used for sealing and encapsulating electronic devices such as chip-on-flex or chip-on-board applications. It is flexible, solvent free, and moisture resistant. 10 mL MR Syringe.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Dymax Ultra Light-Weld® 9008 UV Curing Encapsulant Clear 10 mL MR Syringe - 9008 10ML MR SYRINGE - Ellsworth Adhesives
Germantown, WI, USA
Dymax Ultra Light-Weld® 9008 UV Curing Encapsulant Clear 10 mL MR Syringe
9008 10ML MR SYRINGE
Dymax Ultra Light-Weld® 9008 UV Curing Encapsulant Clear 10 mL MR Syringe 9008 10ML MR SYRINGE
DYMAX Ultra Light-Weld 9008 UV Curable Encapsulant is used for sealing and encapsulating electronic devices such as chip-on-flex or chip-on-board applications. It is flexible, solvent free, and moisture resistant. 10 mL MR Syringe.

DYMAX Ultra Light-Weld 9008 UV Curable Encapsulant is used for sealing and encapsulating electronic devices such as chip-on-flex or chip-on-board applications. It is flexible, solvent free, and moisture resistant. 10 mL MR Syringe.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Sealants
Product Number 9008 10ML MR SYRINGE
Product Name Dymax Ultra Light-Weld® 9008 UV Curing Encapsulant Clear 10 mL MR Syringe
Cure / Technology Single Component
Substrate Compatibility Metal
Features Encapsulant, Potting Compound
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Applications - Ammunition Sealant - Blank Ammo Sealant 48641 - 34864130 - Hernon Manufacturing, Inc.
Specs
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
KM 2740 Series -  - Beacon Adhesives, Inc.
Beacon Adhesives, Inc.
View Details
Heat Transfer Compound - SnapTrace® - Thermon, Inc
Specs
Features Gap Filler, Foam in Place Gasket; Thermally Conductive
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details
C-SHIELD RF Conductive Caulking Compound and Sealer -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Type / Form Liquid
Features Caulk, Grout; Electrically Conductive
View Details