Swissbit AG Industrial Embedded MMC, EM-30 (153-b), ATS2, 32 GB, 3D TLC Flash, -40°C to +85°C SFEM032GB2ED1TO-I-5E-111-STD

Description
JEDEC e.MMC 5.1 Standard (JESD84-B51A) 153-ball BGA, 0.5mm pitch 11.5 x 13mm 100-ball BGA, 1.0mm pitch 14.0 x 18mm Operational Temperature Range -40°C to 105°C Multiple partitions in 3D TLC and pSLC configurable (EM-30) Preconfigured in 100% pSLC mode (EM-36) AEC-Q100-2/3 automotive standard Read disturb managed Power fail protected Small form factor embedded systems have often used NAND components, which were directly interfaced and managed by the host controller software. This task has become a challenge due to the increasing complexity of NAND devices and their management. Managed NAND is the solution: a single small size BGA component incorporates multiple Flash dies, a NAND controller and the management firmware and eases the integration. Swissbit’s e.MMC EM-20 and EM-30 family covers multiple densities and interface speeds. Sophisticated NAND management makes the e.MMC ideal for applications like POS/POI, PLC, IoT, gaming, medical, or as a general boot medium for embedded applications. The EN-20 PCIe/NVMe BGA opens the door for high speed at small size.
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Industrial Embedded MMC, EM-30 (153-b), ATS2, 32 GB, 3D TLC Flash, -40°C to +85°C - SFEM032GB2ED1TO-I-5E-111-STD - Swissbit AG
Bronschhofen, Switzerland
Industrial Embedded MMC, EM-30 (153-b), ATS2, 32 GB, 3D TLC Flash, -40°C to +85°C
SFEM032GB2ED1TO-I-5E-111-STD
Industrial Embedded MMC, EM-30 (153-b), ATS2, 32 GB, 3D TLC Flash, -40°C to +85°C SFEM032GB2ED1TO-I-5E-111-STD
JEDEC e.MMC 5.1 Standard (JESD84-B51A) 153-ball BGA, 0.5mm pitch 11.5 x 13mm 100-ball BGA, 1.0mm pitch 14.0 x 18mm Operational Temperature Range -40°C to 105°C Multiple partitions in 3D TLC and pSLC configurable (EM-30) Preconfigured in 100% pSLC mode (EM-36) AEC-Q100-2/3 automotive standard Read disturb managed Power fail protected Small form factor embedded systems have often used NAND components, which were directly interfaced and managed by the host controller software. This task has become a challenge due to the increasing complexity of NAND devices and their management. Managed NAND is the solution: a single small size BGA component incorporates multiple Flash dies, a NAND controller and the management firmware and eases the integration. Swissbit’s e.MMC EM-20 and EM-30 family covers multiple densities and interface speeds. Sophisticated NAND management makes the e.MMC ideal for applications like POS/POI, PLC, IoT, gaming, medical, or as a general boot medium for embedded applications. The EN-20 PCIe/NVMe BGA opens the door for high speed at small size.
  • JEDEC e.MMC 5.1 Standard (JESD84-B51A)
  • 153-ball BGA, 0.5mm pitch 11.5 x 13mm
  • 100-ball BGA, 1.0mm pitch 14.0 x 18mm
  • Operational Temperature Range -40°C to 105°C
  • Multiple partitions in 3D TLC and pSLC configurable (EM-30)
  • Preconfigured in 100% pSLC mode (EM-36)
  • AEC-Q100-2/3 automotive standard
  • Read disturb managed
  • Power fail protected

Small form factor embedded systems have often used NAND components, which were directly interfaced and managed by the host controller software. This task has become a challenge due to the increasing complexity of NAND devices and their management.

Managed NAND is the solution: a single small size BGA component incorporates multiple Flash dies, a NAND controller and the management firmware and eases the integration. Swissbit’s e.MMC EM-20 and EM-30 family covers multiple densities and interface speeds. Sophisticated NAND management makes the e.MMC ideal for applications like POS/POI, PLC, IoT, gaming, medical, or as a general boot medium for embedded applications. The EN-20 PCIe/NVMe BGA opens the door for high speed at small size.

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Technical Specifications

  Swissbit AG
Product Category Flash Memory Cards
Product Number SFEM032GB2ED1TO-I-5E-111-STD
Product Name Industrial Embedded MMC, EM-30 (153-b), ATS2, 32 GB, 3D TLC Flash, -40°C to +85°C
Memory Type 3D TLC
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