Our attenuators are available in a low power chip package as well as a 0.250 sq high power BeO package. The input power ratings range from 0.1 to 120 watts. The attenuation values range from 0 dB to 20 dB with 30 dB available on some devices. The terminals of our chip attenuators are made with thick or thin film material. Smith Interconnect is the world leader in fixed attenuators from DC through Q band.
Features & Benefits
Terminals are nickel plated and solder coated or silver over nickel RoHS compliant lead free. Also available in wire bondable gold terminals Our chip attenuators are available with thick film resist, tantalum nitride or nichrome thin film resist materials. The TS04, TS07, TS09, TT9, KFA and HPCA series use thick film resistor elements. The TSX, TS03, TS05 and TS06 use tantalum Nitride thin film resistors. The devices are available for shipping in waffle pack or tape and reel packaging.
Surface mount chip attenuators are designed for direct installation on printed circuit boards. Edge metallization on two sides forms the solder fillets for stronger attachment, easier inspection, and increased heat removal area. The wire bondable devices are epoxied ore soldered ground with wire or ribbon bonded to input/output terminals. The devices are available in Alumina, Aluminum Nitride (AlN), BeO and CVD diamond. All devices are available RoHS compliant.
Substrates - BeO, AlN, Alumina and CVD Diamond
Commercial and High Reliability Product Lines
Frequency Range from DC to 50 GHz
Attenuation Values from 0 to 30dB
Space and Military Qualified
Surface mountable, wire bondable and coaxial configurations
Our attenuators are available in a low power chip package as well as a 0.250 sq high power BeO package. The input power ratings range from 0.1 to 120 watts. The attenuation values range from 0 dB to 20 dB with 30 dB available on some devices. The terminals of our chip attenuators are made with thick or thin film material. Smith Interconnect is the world leader in fixed attenuators from DC through Q band.
Features & Benefits
Terminals are nickel plated and solder coated or silver over nickel RoHS compliant lead free. Also available in wire bondable gold terminals Our chip attenuators are available with thick film resist, tantalum nitride or nichrome thin film resist materials. The TS04, TS07, TS09, TT9, KFA and HPCA series use thick film resistor elements. The TSX, TS03, TS05 and TS06 use tantalum Nitride thin film resistors. The devices are available for shipping in waffle pack or tape and reel packaging.
Surface mount chip attenuators are designed for direct installation on printed circuit boards. Edge metallization on two sides forms the solder fillets for stronger attachment, easier inspection, and increased heat removal area. The wire bondable devices are epoxied ore soldered ground with wire or ribbon bonded to input/output terminals. The devices are available in Alumina, Aluminum Nitride (AlN), BeO and CVD diamond. All devices are available RoHS compliant.
- Substrates - BeO, AlN, Alumina and CVD Diamond
- Commercial and High Reliability Product Lines
- Frequency Range from DC to 50 GHz
- Attenuation Values from 0 to 30dB
- Space and Military Qualified
- Surface mountable, wire bondable and coaxial configurations
