Sensata Technologies860 Series CSP/BGA/QFN Devices
Sensata Technologies
Done
Description
Versatile, low cost socket base
Passive heat sink or Heat Sink/Heater/Sensor
Replaceable contact set
Heater - foil or cartridge as required
Sensor - RTD in complaint and isolated "button" unless otherwise specified
Heat Sink - simulations confirm application
Positive locking lid
High mechanical advantage lid and latch provides low actuation force for high I/O packages - 12:1
Versatile, low cost socket base
Passive heat sink or Heat Sink/Heater/Sensor
Replaceable contact set
Heater - foil or cartridge as required
Sensor - RTD in complaint and isolated "button" unless otherwise specified
Heat Sink - simulations confirm application
Positive locking lid
High mechanical advantage lid and latch provides low actuation force for high I/O packages - 12:1
Versatile, low cost socket base
Passive heat sink or Heat Sink/Heater/Sensor
Replaceable contact set
Heater - foil or cartridge as required
Sensor - RTD in complaint and isolated "button" unless otherwise specified
Heat Sink - simulations confirm application
Positive locking lid
High mechanical advantage lid and latch provides low actuation force for high I/O packages - 12:1