Sensata Technologies 860 Series CSP/BGA/QFN Devices

Description
Versatile, low cost socket base Passive heat sink or Heat Sink/Heater/Sensor Replaceable contact set Heater - foil or cartridge as required Sensor - RTD in complaint and isolated "button" unless otherwise specified Heat Sink - simulations confirm application Positive locking lid High mechanical advantage lid and latch provides low actuation force for high I/O packages - 12:1
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860 Series CSP/BGA/QFN Devices -  - Sensata Technologies
Attleboro, MA, USA
860 Series CSP/BGA/QFN Devices
860 Series CSP/BGA/QFN Devices
Versatile, low cost socket base Passive heat sink or Heat Sink/Heater/Sensor Replaceable contact set Heater - foil or cartridge as required Sensor - RTD in complaint and isolated "button" unless otherwise specified Heat Sink - simulations confirm application Positive locking lid High mechanical advantage lid and latch provides low actuation force for high I/O packages - 12:1
  • Versatile, low cost socket base
  • Passive heat sink or Heat Sink/Heater/Sensor
  • Replaceable contact set
  • Heater - foil or cartridge as required
  • Sensor - RTD in complaint and isolated "button" unless otherwise specified
  • Heat Sink - simulations confirm application
  • Positive locking lid
  • High mechanical advantage lid and latch provides low actuation force for high I/O packages - 12:1
Supplier's Site Datasheet

Technical Specifications

  Sensata Technologies
Product Category IC Interconnect Components
Product Name 860 Series CSP/BGA/QFN Devices
Product Type IC Socket
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