0.5mm and 0.8mm pitch
Compression surface mount
High performance/low cost achieved through use of carrier loaded stamped contact
Z-axis compliant buckling beam contact supports any type solder ball shape and composition
Compact outline and low actuation force achieved through use of innovative latching mechanism
0.5mm and 0.8mm pitch
Compression surface mount
High performance/low cost achieved through use of carrier loaded stamped contact
Z-axis compliant buckling beam contact supports any type solder ball shape and composition
Compact outline and low actuation force achieved through use of innovative latching mechanism
0.5mm and 0.8mm pitch
Compression surface mount
High performance/low cost achieved through use of carrier loaded stamped contact
Z-axis compliant buckling beam contact supports any type solder ball shape and composition
Compact outline and low actuation force achieved through use of innovative latching mechanism
