Sensata Technologies 29 Series Two Piece 2x2 Universal Pin Grid Array Carrier with Clip

Description
Accepts wide range of PGA packages from 8 X 8 through 15 X 15 Carrier can be molded from Electro-Static-Dissi pative (ESD) materials Designed to be used with automatic test handlers For other PGA requirements consult factory Molded for high temperature materials for applications up to 150°C For additional stand-off configurations consult
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29 Series Two Piece 2x2 Universal Pin Grid Array Carrier with Clip -  - Sensata Technologies
Attleboro, MA, USA
29 Series Two Piece 2x2 Universal Pin Grid Array Carrier with Clip
29 Series Two Piece 2x2 Universal Pin Grid Array Carrier with Clip
Accepts wide range of PGA packages from 8 X 8 through 15 X 15 Carrier can be molded from Electro-Static-Dissi pative (ESD) materials Designed to be used with automatic test handlers For other PGA requirements consult factory Molded for high temperature materials for applications up to 150°C For additional stand-off configurations consult
  • Accepts wide range of PGA packages from 8 X 8 through 15 X 15
  • Carrier can be molded from Electro-Static-Dissipative (ESD) materials
  • Designed to be used with automatic test handlers
  • For other PGA requirements consult factory
  • Molded for high temperature materials for applications up to 150°C
  • For additional stand-off configurations consult
Supplier's Site Datasheet

Technical Specifications

  Sensata Technologies
Product Category IC Interconnect Components
Product Name 29 Series Two Piece 2x2 Universal Pin Grid Array Carrier with Clip
Product Type IC Socket
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