Plastic enclosures for encapsulating electronics
Comprehensive range of boxes for potting electronic assemblies. With special cost advantages for series type production.
potted assemblies are protected from shock as well as temperature, dampness and chemical influences
Duroplast: resistant to deformation and extreme temperatures, less resistant to impact than the PA or ABS models, 19 sizes (0.787" x 0.787" x 0.516" to 3.937" x 3.937" x 1.575"), optional lids available
Plastic enclosures for encapsulating electronics
Comprehensive range of boxes for potting electronic assemblies. With special cost advantages for series type production.
- potted assemblies are protected from shock as well as temperature, dampness and chemical influences
- Duroplast: resistant to deformation and extreme temperatures, less resistant to impact than the PA or ABS models, 19 sizes (0.787" x 0.787" x 0.516" to 3.937" x 3.937" x 1.575"), optional lids available
