OptiSpac, Inc. Power Chip Hermetic Package

Description
The package design usually adopts ceramic ring frame high temperature brazing Kovar alloy metal sealing ring, metal heat dissipation bottom plate structure, shape structure, size and feed pipe foot number can be customized. This kind of packaging package product adopts a stable and reliable high-temperature brazing integration process, which can meet the requirements of rear channel micro-assembly and parallel seam welding process. The illustrated sample shows a 4-side 28pin power chip package structure with a sealing surface size of 15? x 9?.
  • Power Chip Hermetic Package - OptiSpac, Inc.
    OptiSpac, Inc.
Description
The package design usually adopts ceramic ring frame high temperature brazing Kovar alloy metal sealing ring, metal heat dissipation bottom plate structure, shape structure, size and feed pipe foot number can be customized. This kind of packaging package product adopts a stable and reliable high-temperature brazing integration process, which can meet the requirements of rear channel micro-assembly and parallel seam welding process. The illustrated sample shows a 4-side 28pin power chip package structure with a sealing surface size of 15? x 9?.

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Description
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Power Chip Hermetic Package - - OptiSpac, Inc.
OptiSpac, Inc.
Santa Clarita, CA, USA
Power Chip Hermetic Package
Power Chip Hermetic Package
The package design usually adopts ceramic ring frame high temperature brazing Kovar alloy metal sealing ring, metal heat dissipation bottom plate structure, shape structure, size and feed pipe foot number can be customized. This kind of packaging package product adopts a stable and reliable high-temperature brazing integration process, which can meet the requirements of rear channel micro-assembly and parallel seam welding process. The illustrated sample shows a 4-side 28pin power chip package structure with a sealing surface size of 15? x 9?.

The package design usually adopts ceramic ring frame high temperature brazing Kovar alloy metal sealing ring, metal heat dissipation bottom plate structure, shape structure, size and feed pipe foot number can be customized. This kind of packaging package product adopts a stable and reliable high-temperature brazing integration process, which can meet the requirements of rear channel micro-assembly and parallel seam welding process. The illustrated sample shows a 4-side 28pin power chip package structure with a sealing surface size of 15? x 9?.

Supplier's Site

Technical Specifications

  OptiSpac, Inc.
Product Category Electronic Packages and Lids
Product Name Power Chip Hermetic Package
Hermeticity ≤ 1x10-3Pa●cm3/s(He)
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