The package design usually uses metal ring frame embedded ceramic feed through components, brazed vacuum catheter, metal heat dissipation bottom plate structure, supporting germanium window or sapphire window cover plate. Package products meet the requirements of air tightness and thermal insulation packaging through the complex cavity integrated with high precision mold. Synchronous supporting of high and reliable light window cover plate, to meet the parallel seam welding process. If necessary, the optical window cover plate can be specially designed for the strong mechanical impact requirements of the sensor module.
| OptiSpac, Inc. | |
|---|---|
| Product Category | Electronic Packages and Lids |
| Product Name | Infrared Sensor Metal Hermetic Package |
| Package Material | Copper (optional feature); Tungsten (optional feature) |
