Qnnect, formerly Hermetic Solutions Group Domed Lids

Description
Qnnect, formerly Hermetic Solutions Group manufactures high-quality domed can lids (typically used as both the lid and the side wall of a hermetic microelectronic package) to support our customers using platform headers.
  • Domed Lids - Qnnect, formerly Hermetic Solutions Group
    Qnnect, formerly Hermetic Solutions Group
Description
Qnnect, formerly Hermetic Solutions Group manufactures high-quality domed can lids (typically used as both the lid and the side wall of a hermetic microelectronic package) to support our customers using platform headers.

Suppliers

Company
Product
Description
Supplier Links
Domed Lids - - Qnnect, formerly Hermetic Solutions Group
Qnnect, formerly Hermetic Solutions Group
Painesville, OH, United States
Domed Lids
Domed Lids
Qnnect, formerly Hermetic Solutions Group manufactures high-quality domed can lids (typically used as both the lid and the side wall of a hermetic microelectronic package) to support our customers using platform headers.

Qnnect, formerly Hermetic Solutions Group manufactures high-quality domed can lids (typically used as both the lid and the side wall of a hermetic microelectronic package) to support our customers using platform headers.

Supplier's Site

Technical Specifications

  Qnnect, formerly Hermetic Solutions Group
Product Category Electronic Packages and Lids
Product Name Domed Lids
Package Material Kovar
Unlock Full Specs
to access all available technical data

Similar Products

Power Chip Hermetic Package - - OptiSpac, Inc.
OptiSpac, Inc.
Power Chip Hermetic Package
Specs
Hermeticity ≤ 1x10-3Pa●cm3/s(He)
Insulation Resistance ≥1x1010Ω(500V●DC)
View Details
Power Packages - - Qnnect, formerly Hermetic Solutions Group
Qnnect, formerly Hermetic Solutions Group
Power Packages
Specs
Package Material Copper, Copper Tungsten, Copper Moly, GlidCop, Al/Si, Copper Graphite and Graphite Diamond
Hermeticity 1x10-9 He@1ATM
View Details
ATG Microwave Packages - - Advanced Technology Group, Inc.
Advanced Technology Group, Inc.
ATG Microwave Packages
View Details
TOSA/ROSA Hermetic Package - - OptiSpac, Inc.
OptiSpac, Inc.
TOSA/ROSA Hermetic Package
Specs
Package Material Copper (optional feature); Tungsten (optional feature)
Hermeticity ≤ 1x10-3Pa●cm3/s(He)
Insulation Resistance ≥1x1010Ω(500V●DC)
View Details