Master Bond, Inc. Two Component Silver Conductive Epoxy EP77M-1

Description
Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. It readily develops a high bonding strength of more than 2000 psi tensile shear when measured and cured at 75°F. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is less than 10-3 ohm-cm. EP77M-1 offers superior dimensional stability. Master Bond Polymer System EP77M-1 can be applied with minimal sagging or dripping even on vertical surfaces although it can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent (xylene, acetone, MEK, etc.) by weight. The high strength bonds are remarkably resistant to chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60 to +300°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Part A is silver, Part B is a clear liquid. Master Bond EP77M-1 adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance, and automotive industries, among others. For convenient handling, EP77M-1 is now available in premixed and frozen syringes.
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Description
Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. It readily develops a high bonding strength of more than 2000 psi tensile shear when measured and cured at 75°F. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is less than 10-3 ohm-cm. EP77M-1 offers superior dimensional stability. Master Bond Polymer System EP77M-1 can be applied with minimal sagging or dripping even on vertical surfaces although it can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent (xylene, acetone, MEK, etc.) by weight. The high strength bonds are remarkably resistant to chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60 to +300°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Part A is silver, Part B is a clear liquid. Master Bond EP77M-1 adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance, and automotive industries, among others. For convenient handling, EP77M-1 is now available in premixed and frozen syringes.
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Suppliers

Company
Product
Description
Supplier Links
Two Component Silver Conductive Epoxy - EP77M-1 - Master Bond, Inc.
Hackensack, NJ, USA
Two Component Silver Conductive Epoxy
EP77M-1
Two Component Silver Conductive Epoxy EP77M-1
Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. It readily develops a high bonding strength of more than 2000 psi tensile shear when measured and cured at 75°F. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is less than 10-3 ohm-cm. EP77M-1 offers superior dimensional stability. Master Bond Polymer System EP77M-1 can be applied with minimal sagging or dripping even on vertical surfaces although it can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent (xylene, acetone, MEK, etc.) by weight. The high strength bonds are remarkably resistant to chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60 to +300°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Part A is silver, Part B is a clear liquid. Master Bond EP77M-1 adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance, and automotive industries, among others. For convenient handling, EP77M-1 is now available in premixed and frozen syringes.

Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. It readily develops a high bonding strength of more than 2000 psi tensile shear when measured and cured at 75°F. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is less than 10-3 ohm-cm. EP77M-1 offers superior dimensional stability. Master Bond Polymer System EP77M-1 can be applied with minimal sagging or dripping even on vertical surfaces although it can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent (xylene, acetone, MEK, etc.) by weight. The high strength bonds are remarkably resistant to chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60 to +300°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Part A is silver, Part B is a clear liquid. Master Bond EP77M-1 adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance, and automotive industries, among others. For convenient handling, EP77M-1 is now available in premixed and frozen syringes.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP77M-1
Product Name Two Component Silver Conductive Epoxy
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
Chemical System Epoxy
Composition Filled
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