Master Bond, Inc. Epoxy Features Very Low Coefficient of Thermal Expansion EP30LTE-2

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Epoxy Features Very Low Coefficient of Thermal Expansion - EP30LTE-2 - Master Bond, Inc.
Hackensack, NJ, USA
Epoxy Features Very Low Coefficient of Thermal Expansion
EP30LTE-2
Epoxy Features Very Low Coefficient of Thermal Expansion EP30LTE-2
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP30LTE-2
Product Name Epoxy Features Very Low Coefficient of Thermal Expansion
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Epoxy
Composition Unfilled
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