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Master Bond, Inc. Two Component Thermally Conductive Epoxy EP21TDCAOHT

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Two Component Thermally Conductive Epoxy - EP21TDCAOHT - Master Bond, Inc.
Hackensack, NJ, USA
Two Component Thermally Conductive Epoxy
EP21TDCAOHT
Two Component Thermally Conductive Epoxy EP21TDCAOHT
EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix ratio(1:1), weight or volume, and is serviceable over an exceptionally wide temperature range of -100 to 400°F. As a flexibilized system, it is an ideal adhesive for bond dissimilar substrates when thermal conductivity is needed. EP21TDCAOHT has superior thermal and mechanical shock resistance and is readily thermally cyclable.

EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix ratio(1:1), weight or volume, and is serviceable over an exceptionally wide temperature range of -100 to 400°F. As a flexibilized system, it is an ideal adhesive for bond dissimilar substrates when thermal conductivity is needed. EP21TDCAOHT has superior thermal and mechanical shock resistance and is readily thermally cyclable.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP21TDCAOHT
Product Name Two Component Thermally Conductive Epoxy
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Chemical System Epoxy; Polyurethane
Composition Filled
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