- Trained on our vast library of engineering resources.

Master Bond, Inc. Nickel Filled Electrically Conductive Epoxy System EP76M

Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Nickel Filled Electrically Conductive Epoxy System - EP76M - Master Bond, Inc.
Hackensack, NJ, USA
Nickel Filled Electrically Conductive Epoxy System
EP76M
Nickel Filled Electrically Conductive Epoxy System EP76M
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M has a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi tensile shear when measured and cured at 75°F. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is 5-10 ohm-cm. Master Bond Polymer System EP76M can be applied with minimal sagging or dripping even on vertical surfaces, although it can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent (xylene, acetone, MEK, etc.) by weight. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oil and most organic solvents over the exceptionally wide temperature range of -60°F to more than +250°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Parts A and B are both colored gray. Master Bond EP76M adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance and automotive industries among others. There are also are a number of specialized versions of EP76M available. These include EP76 which meets certain military specs, EP76M-F which is a fast curing version (5-10 minute set up time), and EP76MHT which is a high temperature resistant version (serviceable up to 400°F).

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M has a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi tensile shear when measured and cured at 75°F. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is 5-10 ohm-cm. Master Bond Polymer System EP76M can be applied with minimal sagging or dripping even on vertical surfaces, although it can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent (xylene, acetone, MEK, etc.) by weight. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oil and most organic solvents over the exceptionally wide temperature range of -60°F to more than +250°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Parts A and B are both colored gray. Master Bond EP76M adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance and automotive industries among others. There are also are a number of specialized versions of EP76M available. These include EP76 which meets certain military specs, EP76M-F which is a fast curing version (5-10 minute set up time), and EP76MHT which is a high temperature resistant version (serviceable up to 400°F).

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP76M
Product Name Nickel Filled Electrically Conductive Epoxy System
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Rubber or Elastomer
Chemical System Epoxy
Composition Filled
Unlock Full Specs
to access all available technical data

Similar Products

Low Viscosity Structural Epoxy Adhesive System - EP112 - Master Bond, Inc.
Specs
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer
Form / Shape Liquid
Industry Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; OEM or Industrial; Photonics; Semiconductors, IC's; Tooling
View Details
Two Component Highly Flexibilized Epoxy - EP21TDC-2AO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
View Details
Quartz Filled, Two Component Epoxy - EP30QF - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Epoxy Adhesive with Ultra Low Thermal Resistance - EP48TC - Master Bond, Inc.
Specs
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Chemical System Epoxy
Composition Filled
View Details