Master Bond, Inc. One component, high temperature resistant epoxy system for bonding and sealing EP17HTDA-1

Description
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be used in vacuum situations
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Description
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be used in vacuum situations
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Suppliers

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One component, high temperature resistant epoxy system for bonding and sealing - EP17HTDA-1 - Master Bond, Inc.
Hackensack, NJ, USA
One component, high temperature resistant epoxy system for bonding and sealing
EP17HTDA-1
One component, high temperature resistant epoxy system for bonding and sealing EP17HTDA-1
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be used in vacuum situations

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be used in vacuum situations

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP17HTDA-1
Product Name One component, high temperature resistant epoxy system for bonding and sealing
Cure / Technology Thermoset; Single Component
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Chemical System Epoxy
Composition Unfilled
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