Master Bond, Inc. Thermally Conductive, Dimensionally Stable Epoxy EP21AO

Master Bond Polymer Adhesive EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics, and many plastics. As a thermally conductive adhesive it forms high strength bonds of over 1800 psi tensile shear. EP21AO resists a wide range of chemicals including water, oils, fuels, and some solvents over the temperature range of -60°F to +250°F. It also possesses a low coefficient of expansion and excellent dimensional stability. A low viscosity version called EP21AOLV is also available. That system is particularly well suited for potting applications.