Formulated for potting, coating and sealing applications, EP113 is a two component, nano silica filled epoxy. The nano particles enhance the dimensional stability and the already exceptionally low shrinkage upon curing. This low viscosity system bonds well to a wide variety of substrates including metals, composites, glass, ceramics and plastics. As a toughened compound, it has good resistance to thermal cycling and shock over the wide temperature range of -100°F to +450°F [-73°C to +232°C]. Additionally, this compound is a top tier electrical insulator.
| Master Bond, Inc. | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | EP113 |
| Product Name | Nanosilica Filled, Optically Clear Epoxy Adhesive |
| Cure / Technology | Thermoset; Two Component |
| Type / Form | Liquid |
| Substrate Compatibility | Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates |
| Chemical System | Epoxy |
| Composition | Filled |
