Master Bond, Inc. One Component Toughened Epoxy System For Bonding And Sealing Supreme 17HT

Description
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties.
Request a Quote
Description
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
One Component Toughened Epoxy System For Bonding And Sealing - Supreme 17HT - Master Bond, Inc.
Hackensack, NJ, USA
One Component Toughened Epoxy System For Bonding And Sealing
Supreme 17HT
One Component Toughened Epoxy System For Bonding And Sealing Supreme 17HT
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties.

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number Supreme 17HT
Product Name One Component Toughened Epoxy System For Bonding And Sealing
Cure / Technology Thermoset; Single Component
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Epoxy
Composition Unfilled
Unlock Full Specs
to access all available technical data

Similar Products

Thermally Conductive, Heat Resistant Epoxy - EP21TCHT-1 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
View Details
Two Component, Addition Cured Silicone for High Performance Bonding and Sealing - MasterSil 153Med - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cured
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Silicone
View Details
Thermally Conductive, Heat Resistant Epoxy - EP21TCHT-1 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
View Details
Toughened, Non-Drip Epoxy Meets NASA Low Outgassing Specifications - EP40ND - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Epoxy
View Details