Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88 W/(m•K)] and can be applied in sections as thin as 5-15 microns, resulting in a low thermal resistance.
| Master Bond, Inc. | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | EP30TC |
| Product Name | Room Temperature Curing Epoxy Features Low Thermal Resistance |
| Cure / Technology | Thermoset; Two Component ; Room Temperature Vulcanizing or Curing |
| Type / Form | Liquid |
| Substrate Compatibility | Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates |
| Chemical System | Epoxy |
| Composition | Filled |
