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Master Bond, Inc. Room Temperature Curing Epoxy Features Low Thermal Resistance EP30TC

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Room Temperature Curing Epoxy Features Low Thermal Resistance - EP30TC - Master Bond, Inc.
Hackensack, NJ, USA
Room Temperature Curing Epoxy Features Low Thermal Resistance
EP30TC
Room Temperature Curing Epoxy Features Low Thermal Resistance EP30TC
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88 W/(m•K)] and can be applied in sections as thin as 5-15 microns, resulting in a low thermal resistance.

Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88 W/(m•K)] and can be applied in sections as thin as 5-15 microns, resulting in a low thermal resistance.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number EP30TC
Product Name Room Temperature Curing Epoxy Features Low Thermal Resistance
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Chemical System Epoxy
Composition Filled
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