mr-NIL212FC is a purely organic, photo-curable NIL resist with outstanding dry etch characteristics, fast curing properties and an excellent nanoimprint performance. It is particularly suited for soft-NIL using soft stamp materials such as PDMS. mr-NIL212FC exhibits a markedly enhanced etching stability in RIE processes compared to mr-NIL210.
Excellent stability in plasma etching processes
Fast curing even with low intensity light exposure source
Excellent liquid thin film stability and thin film quality
Outstanding compatibility with flexible stamp materials
Residue-free removal with oxygen plasma post-cure
mr-NIL212FC is a purely organic, photo-curable NIL resist with outstanding dry etch characteristics, fast curing properties and an excellent nanoimprint performance. It is particularly suited for soft-NIL using soft stamp materials such as PDMS. mr-NIL212FC exhibits a markedly enhanced etching stability in RIE processes compared to mr-NIL210.
- Excellent stability in plasma etching processes
- Fast curing even with low intensity light exposure source
- Excellent liquid thin film stability and thin film quality
- Outstanding compatibility with flexible stamp materials
- Residue-free removal with oxygen plasma post-cure
