Formulated for ultra‑thick film processes, SU‑8 XFT delivers improved adhesion and reduced coating stress for reliable high‑performance patterning.
With a single‑coat capability of 50 to over 200 μm, SU‑8 XFT supports extremely thick layers while maintaining excellent imaging quality. It produces high‑aspect‑ratio structures exceeding 5:1 with near‑vertical sidewalls, making it ideal for demanding permanent microfabrication applications.
Key Features
High aspect ratio imaging of ultra-thick structures
Vertical sidewalls
i-line (365 nm) and broadband processing
Improved adhesion
Reduced coating stress
50 to 200 μm film thickness in a single coat
Formulated for ultra‑thick film processes, SU‑8 XFT delivers improved adhesion and reduced coating stress for reliable high‑performance patterning.
With a single‑coat capability of 50 to over 200 μm, SU‑8 XFT supports extremely thick layers while maintaining excellent imaging quality. It produces high‑aspect‑ratio structures exceeding 5:1 with near‑vertical sidewalls, making it ideal for demanding permanent microfabrication applications.
Key Features
- High aspect ratio imaging of ultra-thick structures
- Vertical sidewalls
- i-line (365 nm) and broadband processing
- Improved adhesion
- Reduced coating stress
- 50 to 200 μm film thickness in a single coat
