Kayaku Advanced Materials, Inc. Datasheets for Thick Film Materials
Thick film materials are metal conductor pastes or dielectric ceramic pastes. They are screen printed and fired to produce circuits, resistors, capacitors, and interconnects for electronic devices on ceramic substrates.
Thick Film Materials: Learn more
| Product Name | Notes |
|---|---|
| As an improved formulation of the original SU‑8 and SU‑8 2000, SU‑8 3000 offers enhanced adhesion, reduced coating stress, and reliable performance trusted by MEMS manufacturers. With viscosities that support... | |
| Built on a low-halogen, antimony-free epoxy formulation, SU-8 3000CF Dry Film enables high aspect ratio structures such as cavity walls, capping layers, and structural features in advanced microelectronic and MEMS... | |
| Conventional pattern transfer and single-layer lift-off for microelectronics and micro systems technology High wet and dry etch resistance Good thermal stability of the resist pattern Tunable pattern profile: vertical to... | |
| Designed for cavity definition and capping in applications such as BAW, SAW, and microfluidic devices, these resists provide excellent alignment accuracy, low‑temperature processing, and high‑quality bond formation. Perminex adhesives enable... | |
| Designed for the production of micro-optical components and wafer scale patterning Thickness up to 270 μm by spin coating (OrmoClear®30) Highly transparent for near UV and VIS down... | |
| Designed for the production of micro-optical components produced by UV moulding of optical components UV patterning (lithography, moulding and imprint) Highly transparent for VIS and near UV down to 350... | |
| During exposure, the photoresist undergoes cross‑linking, creating highly stable regions that become insoluble in standard liquid developers, ensuring precise pattern retention. With its excellent optical transparency above 360 nm, SU‑8... | |
| Formulated by dissolving PMMA polymer in safe solvents such as anisole, it functions as a high‑resolution positive e‑beam resist, offering exceptional pattern fidelity, easy processing, and excellent film quality. Beyond... | |
| Formulated for ultra‑thick film processes, SU‑8 XFT delivers improved adhesion and reduced coating stress for reliable high‑performance patterning. With a single‑coat capability of 50 to over 200 μm, SU‑8 XFT... | |
| KMPR® 1000 develops in standard aqueous TMAH developers and can be removed more easily after fabrication compared to traditional epoxy resists. Available in five viscosities, KMPR® 1000 enables... | |
| KMSF® 2000 is a negative‑tone, low‑temperature‑cure PPE‑copolymer photo‑dielectric designed for high‑reliability heterogeneous integration in advanced packaging. It features excellent pattern resolution, a low dielectric constant (Dk = 2.5), and... | |
| KMSF®1000 is a negative‑tone, polyimide‑based photo‑dielectric designed for ultra‑low‑stress buffering, passivation, and protective layers in advanced microelectronic packaging. Engineered to provide exceptional warpage control, it is well suited... | |
| Low viscosity, solvent-free photo-curable NIL resist specifically designed for use with rigid and gas-impermeable working stamps like COC, COP, OrmoStamp®, or glass. Mask for pattern transfer processes (dry... | |
| mr-I 9000M for micro and nanofabrication Short imprint cycle Thermal curing during imprint Compatible with various substrates including Si, Si02 and Al | |
| mr-NIL212FC is a purely organic, photo-curable NIL resist with outstanding dry etch characteristics, fast curing properties and an excellent nanoimprint performance. It is particularly suited for soft-NIL using soft stamp... | |
| Negative photoresist series well suited for e-beam and deep UV exposure in the manufacturing of semiconductor devices. High resolution capability (~ 40 – 50 nm) High wet and dry etch... | |
| Negative photoresist series well suited for e-beam and deep UV exposure in the manufacturing of semiconductor devices. High wet and dry etch resistance High resolution capability (~ 40 – 50... | |
| Negative resists for direct laser writing at 405 nm Sensitive above 400 nm, for direct writing laser at 405 nm High thermal and chemical stability High wet and dry etch... | |
| NIL resist applicable by inkjet printing and with high curing speeds suitable for roll-to-roll NIL processes. Excellent imprint characteristics Compatibility to various mold materials (Ni, Si, OrmoStamp®) Good... | |
| NIL resist with a high level of fluorinated components yielding excellent stamp release properties and minimal defects. Very low release forces Excellent wetting properties Fast curing, high resolution | |
| NIL resist with excellent curing and nanoimprint performance in combination with PDMS soft stamp materials. Increased dry etching resistance in demanding plasma processes Excellent reproducibility enabling high volume production Film... | |
| Non-polar thermoplastic for permanent applications. High chemical resistance Excellent UV-vis transparency Film thickness up to 5 µm possible for the fabrication of microfluidic & lab-on-chip devices Appropriate for bio- and... | |
| ORMOCER® System for Planar Optical Waveguides UV patterning (lithography/mouldin g) Exposure: i-line, broadband Thermally stable up to 270°C Low optical loss | |
| Ormostamp® for working stamp fabrication Highly transparent for UV and visible light Mechanically and thermally stable Excellent pattern transfer down to sub-100 nm features | |
| Photoresist series designed for the use in microelectronics and microsystems technology Variety of viscosities for 0.3 – 40 μm film thickness in one spin-coating step Very good pattern stability in... | |
| Resist system for laminated waveguides UV patterning of core and cladding High transmittance at 850 nm High heat and pressure resistance | |
| Sensitive to broadband UV exposure (i‑, h‑, and g‑line), SU‑8 TF 6000 provides excellent patterning performance for advanced microfabrication. Available in five optimized viscosities, it produces low‑defect coatings with film... | |
| Silicon-containing thermal nanoimprint resist for the fabrication of high aspect ratio patterns Excellent flowability Imprints can be performed at moderate temperatures in the range of 110 – 140°C. Superior demolding... | |
| TempKoat® N is a chemically amplified, negative‑tone temporary resist designed for advanced packaging and MEMS applications. Engineered for fast processing, it produces high‑aspect‑ratio features with minimal cycle time while... | |
| TempKoat® P is a chemically amplified, positive‑tone temporary resist engineered for advanced packaging and MEMS applications. Designed for thick, single‑coat processing, it delivers high‑aspect‑ratio features with excellent photospeed, resolution,... | |
| Thermoplastics with built-in release properties for use as etch mask for pattern transfer and the fabrication of nanopatterns Excellent properties for thermal NIL Longer life-time of anti-sticking layers on the... | |
| Thick photoresists designed for electroplating structures in microsystems technology High stability in acid and alkaline plating baths High dry and wet etch resistance Side wall angle up to 87° with... | |
| Thick positive photoresist designed for the requirements of grayscale lithography Film thickness from 1 µm up to 60 µm and higher High intensity laser exposure possible without out-gassing 50-60 µm... | |
| UniLOR® N is a negative‑tone, chemically amplified co‑polymer resist designed for single and bi-layer lift off processes. Available in three viscosities, it offers adjustable wall profiles and high thermal... | |
| Used beneath photoresists in a bilayer stack, PMGI and LOR resists create a controlled undercut profile that extends lift-off performance beyond the limits of single-layer systems. These materials support both... | |
| UV-curable material for permanent applications with isothermal processing Excellent film quality on various substrate materials Very low residual layer thickness < 10 nm Excellent pattern transfer fidelity | |
| Thin Positive Resists for Laser Interference Lithography High quality etch patterns due to steep sidewalls Good etch resistance 100-500 nm film thickness |