KMPR® 1000 develops in standard aqueous TMAH developers and can be removed more easily after fabrication compared to traditional epoxy resists.
Available in five viscosities, KMPR® 1000 enables single‑coat thicknesses from 4–110 μm. With excellent adhesion, as well as strong chemical and plasma resistance, it is ideal for MEMS, electrolytic plating, and DRIE applications that require durable, high‑performance microstructures.
Key Features
High aspect ratio imaging Vertical sidewalls
Greater than 100 μm film thickness in a single coat
Aqueous developer compatible (TMAH & KOH)
Wet stripping in conventional strippers
Excellent dry etch resistance
KMPR® 1000 develops in standard aqueous TMAH developers and can be removed more easily after fabrication compared to traditional epoxy resists.
Available in five viscosities, KMPR® 1000 enables single‑coat thicknesses from 4–110 μm. With excellent adhesion, as well as strong chemical and plasma resistance, it is ideal for MEMS, electrolytic plating, and DRIE applications that require durable, high‑performance microstructures.
Key Features
- High aspect ratio imaging Vertical sidewalls
- Greater than 100 μm film thickness in a single coat
- Aqueous developer compatible (TMAH & KOH)
- Wet stripping in conventional strippers
- Excellent dry etch resistance
