InTEGRATED® Solder Preforms are joined in a matrix by fine, precise strands of solder which, during the soldering process, melt and flow to adjacent pads to give you complete preform separation.
Applications
InTEGRATED® Solder Preforms save assembly time and labor costs by allowing simultaneous placement of all the solder preforms needed on connector pins, pin grid arrays (PGAs) and other multiple-pad/pin components. They solve both assembly and product design challenges by allowing users to specify fabrications in the most complex arrays, including those which would be impossible or cost-prohibitive to produce by conventional methods. Arrays can even be designed with built-in frames to improve handling in manual assembly processes.
InTEGRATED® Solder Preforms can also be used in non-array configurations for applications such as vacuum/ cryogenic sealing and other mechanical assembly operations
| Indium Corporation | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | InTEGRATED® Solder Preforms |
| Product Name | Engineered Solder Materials |
| Joining Process / Product Form | Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces. |
