LOCTITE HF 212, No-clean and Halogen-free Solder Paste, High tack, Low voiding, RoHS-compliant Pb-free soldering
LOCTITE® HF 212 is a high tack, low voiding, RoHS-compliant solder paste with excellent fine pitch coalescence and extended stencil life and abandon time. Designed for medium to large boards and compatible with many Pb-free alloys.
Options and Configurations
Alloy: 90iSC, SAC0307, SAC305, SAC387
Particle Size: Type 3, 4, 4.5 (4A), 5
Halogen-free flux: passes IC with pretreatment IPC-TM-650 2.3.34/EN14582
Halogen-free flux classification: ROL0 to ANSI/J-STD-.004 Rev. B
Printing: Fine pitch capability (0.3 mm), stencil life (>8 hours), and abandon time (>4 hours)
Printing: suitable for high-speed printing up to 150 mm/s
Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP)
Colorless residues for easy post-reflow inspection
LOCTITE HF 212, No-clean and Halogen-free Solder Paste, High tack, Low voiding, RoHS-compliant Pb-free soldering
LOCTITE® HF 212 is a high tack, low voiding, RoHS-compliant solder paste with excellent fine pitch coalescence and extended stencil life and abandon time. Designed for medium to large boards and compatible with many Pb-free alloys.
Options and Configurations
- Alloy: 90iSC, SAC0307, SAC305, SAC387
- Particle Size: Type 3, 4, 4.5 (4A), 5
- Halogen-free flux: passes IC with pretreatment IPC-TM-650 2.3.34/EN14582
- Halogen-free flux classification: ROL0 to ANSI/J-STD-.004 Rev. B
- Printing: Fine pitch capability (0.3 mm), stencil life (>8 hours), and abandon time (>4 hours)
- Printing: suitable for high-speed printing up to 150 mm/s
- Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP)
- Colorless residues for easy post-reflow inspection
