MacDermid Alpha Electronics Solutions Solder Paste Materials for Printed Circuit Boards (PCB) ALPHA ® JP-500

Product Overview ALPHA JP-500 is formulated to deliver excellent visual joint cosmetics and is rated ROL0 per IPC J-STD-004. ALPHA JP-500 features a rheology capable of standard dispensing or jetting. This paste is formulated to offer best-in-class in-circuit pin test yields and high electrochemical reliability. ALPHA JP-500 offers outstanding reflow process window and solderability across all traditional surface finishes. Product Features Deposit Capability and Processability of Circular Dimensions Deposit capability and processability of circular dimensions down to 0.25mm (0.010”). Excellent Deposit Consistency with High Process Capability Index Excellent deposit consistency with high process capability index across all board designs. Reduction in Random Solder Balling Levels, Increasing First-Time Yield Excellent Pin-Testability Available in Type 5 and Type 6 Powders