Indium Corporation Solder Paste Indium10.2HF Pb-Free Solder Paste

Description
Indium10.2HF is a no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. The flux residue is formulated to be hard and fast breaking, yet non-tacky after reflow, in order to provide extraordinary flying probe and in-circuit testing (ICT) performance. Indium10.2HF provides excellent head-in-pillow (HIP) and non-wet-open (NWO) resistance along with offering unprecedented stencil print transfer efficiency to work in the broadest range of processes.
Description
Indium10.2HF is a no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. The flux residue is formulated to be hard and fast breaking, yet non-tacky after reflow, in order to provide extraordinary flying probe and in-circuit testing (ICT) performance. Indium10.2HF provides excellent head-in-pillow (HIP) and non-wet-open (NWO) resistance along with offering unprecedented stencil print transfer efficiency to work in the broadest range of processes.

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Indium10.2HF is a no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. The flux residue is formulated to be hard and fast breaking, yet non-tacky after reflow, in order to provide extraordinary flying probe and in-circuit testing (ICT) performance. Indium10.2HF provides excellent head-in-pillow (HIP) and non-wet-open (NWO) resistance along with offering unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Indium10.2HF is a no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. The flux residue is formulated to be hard and fast breaking, yet non-tacky after reflow, in order to provide extraordinary flying probe and in-circuit testing (ICT) performance. Indium10.2HF provides excellent head-in-pillow (HIP) and non-wet-open (NWO) resistance along with offering unprecedented stencil print transfer efficiency to work in the broadest range of processes.

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Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number Indium10.2HF Pb-Free Solder Paste
Product Name Solder Paste
Joining Process / Product Form Braze or solder in the form of a paste.
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