Hernon Manufacturing, Inc. Formulations - Applications - Bonding - Fusionbond 374 337425

Hernon® has taken the excellent bond strength of Fusionbond adhesive family and merged it with the simplicity of a two-component, no-mix curing system to create Fusionbond® 374. Fusionbond® 374 is a 100% solid, room temperature cure, versatile structural adhesive which is used in conjunction with Hernon® Activator 56, 15 or 16. This formulation will offer rapid, high strength and high impact resistant bonds to a variety of substrates within minutes. Designed for a wide variety of substrates, Fusionbond® 374 offers excellent temperature and chemical resistance. The two-component, no-mix system allows controlled assembly ideal for production and repair applications. A structural bond develops within minutes.