Henkel Corporation - Industrial Underfills LOCTITE ECCOBOND FP4526

Description
LOCTITE ECCOBOND FP4526, Epoxy, Underfill LOCTITE® ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications. Low viscosity Fast flow Excellent wettability Excellent adhesion Ideal for high reliability applications Hi-Pb and Pb-free applications
  • Underfills - LOCTITE ECCOBOND FP4526 - Henkel Corporation - Industrial
    Henkel Corporation - Industrial
Datasheet
Description
LOCTITE ECCOBOND FP4526, Epoxy, Underfill LOCTITE® ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications. Low viscosity Fast flow Excellent wettability Excellent adhesion Ideal for high reliability applications Hi-Pb and Pb-free applications
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Underfills - LOCTITE ECCOBOND FP4526 - Henkel Corporation - Industrial
Henkel Corporation - Industrial
Rocky Hill, CT, United States
Underfills
LOCTITE ECCOBOND FP4526
Underfills LOCTITE ECCOBOND FP4526
LOCTITE ECCOBOND FP4526, Epoxy, Underfill LOCTITE® ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications. Low viscosity Fast flow Excellent wettability Excellent adhesion Ideal for high reliability applications Hi-Pb and Pb-free applications

LOCTITE ECCOBOND FP4526, Epoxy, Underfill LOCTITE® ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications.

  • Low viscosity
  • Fast flow
  • Excellent wettability
  • Excellent adhesion
  • Ideal for high reliability applications
  • Hi-Pb and Pb-free applications
Supplier's Site Datasheet

Technical Specifications

  Henkel Corporation - Industrial
Product Category Leveling and Filling Compounds
Product Number LOCTITE ECCOBOND FP4526
Product Name Underfills
Viscosity ? to 1900 cP
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