MacDermid Alpha Electronics Solutions Underfill Materials for Printed Circuit Boards (PCBs) ALPHA ® HiTech ® CU21-3240 Underfill

Product Overview ALPHA HiTech CU21-3240 is a one-component capillary underfill designed to protect assembled chip packages on printed circuit boards. It features a high Glass Transition Temperature (Tg) and low Coefficient of Thermal Expansion (CTE), providing a high-reliability solution. Product Features Full Component Coverage Provides full component coverage when dispensed onto a substrate preheated to 70–100°C. Stringent Thermal Cycling Test Condition High Tg and low CTE values drastically improve the ability to pass more stringent thermal cycling test conditions. Excellent Thermal Cycling Test performance Halogen-Free Complies with RoHS Directive 2015/863/EU