Hamamatsu Photonics Europe Image sensor modules C15853-02

Description
Built-in high-speed InGaAs linear image sensor, USB 3.1 Gen1 interface This image sensor module is equipped with an InGaAs linear image sensor (G14714-1024DK). This product has sensitivity in the near infrared region of 0.95 to 1.7 µm, and is capable of readout at a high-speed line rate of 40 klines/s. It transfers the acquired image signal to a PC via a USB 3.1 Gen1 interface. Various functions can be controlled with USB communication and an external trigger signal. The SMA connector for external trigger input is attached to main body, making it possible to synchronize operation design is necessary, and image acquisition can be done easily. Features -High-speed line rate: 40 klines/s max. -Room temperature operation -Output data: 16-bit -Interface: USB 3.1 Gen1
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Description
Built-in high-speed InGaAs linear image sensor, USB 3.1 Gen1 interface This image sensor module is equipped with an InGaAs linear image sensor (G14714-1024DK). This product has sensitivity in the near infrared region of 0.95 to 1.7 µm, and is capable of readout at a high-speed line rate of 40 klines/s. It transfers the acquired image signal to a PC via a USB 3.1 Gen1 interface. Various functions can be controlled with USB communication and an external trigger signal. The SMA connector for external trigger input is attached to main body, making it possible to synchronize operation design is necessary, and image acquisition can be done easily. Features -High-speed line rate: 40 klines/s max. -Room temperature operation -Output data: 16-bit -Interface: USB 3.1 Gen1
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Datasheet
Datasheet Summary
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The C15853-02 is an image sensor module with a built-in G14714-1024DK InGaAs linear sensor for near-infrared imaging from 0.95 to 1.7 µm, operating at up to 40 klines/s with 16-bit output over a USB 3.1 Gen1 interface. It supports internal and external trigger modes via an SMA connector, uses a C-mount lens interface, and operates at room temperature. The sensor has 1024 pixels with a 12.5 µm pixel pitch and 12.8 × 0.0125 mm active image area. The module measures 60 × 60 × 54 mm and weighs 340 g, powered by a 12.0 V supply with a current consumption of 0.2 to 0.3 A.

Datasheet Summary
Powered by GS/AI

The C15853-02 is an image sensor module with a built-in G14714-1024DK InGaAs linear sensor for near-infrared imaging from 0.95 to 1.7 µm, operating at up to 40 klines/s with 16-bit output over a USB 3.1 Gen1 interface. It supports internal and external trigger modes via an SMA connector, uses a C-mount lens interface, and operates at room temperature. The sensor has 1024 pixels with a 12.5 µm pixel pitch and 12.8 × 0.0125 mm active image area. The module measures 60 × 60 × 54 mm and weighs 340 g, powered by a 12.0 V supply with a current consumption of 0.2 to 0.3 A.

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Image sensor modules - C15853-02 - Hamamatsu Photonics Europe
Herrsching am Ammersee, Germany
Image sensor modules
C15853-02
Image sensor modules C15853-02
Built-in high-speed InGaAs linear image sensor, USB 3.1 Gen1 interface This image sensor module is equipped with an InGaAs linear image sensor (G14714-1024DK). This product has sensitivity in the near infrared region of 0.95 to 1.7 µm, and is capable of readout at a high-speed line rate of 40 klines/s. It transfers the acquired image signal to a PC via a USB 3.1 Gen1 interface. Various functions can be controlled with USB communication and an external trigger signal. The SMA connector for external trigger input is attached to main body, making it possible to synchronize operation design is necessary, and image acquisition can be done easily. Features -High-speed line rate: 40 klines/s max. -Room temperature operation -Output data: 16-bit -Interface: USB 3.1 Gen1

Built-in high-speed InGaAs linear image sensor, USB 3.1 Gen1 interface

This image sensor module is equipped with an InGaAs linear image sensor (G14714-1024DK). This product has sensitivity in the near infrared region of 0.95 to 1.7 µm, and is capable of readout at a high-speed line rate of 40 klines/s. It transfers the acquired image signal to a PC via a USB 3.1 Gen1 interface. Various functions can be controlled with USB communication and an external trigger signal. The SMA connector for external trigger input is attached to main body, making it possible to synchronize operation design is necessary, and image acquisition can be done easily.

Features
-High-speed line rate: 40 klines/s max.
-Room temperature operation
-Output data: 16-bit
-Interface: USB 3.1 Gen1

Supplier's Site Datasheet

Technical Specifications

  Hamamatsu Photonics Europe
Product Category Sensor Chips
Product Number C15853-02
Product Name Image sensor modules
Applications Industrial
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