The XPedite2500 is a configurable, high-performance, conduction- or air-cooled XMC module based on the AMD (formerly Xilinx) Kintex® UltraScale™ family of FPGAs. With a range of high-density and high-bandwidth I/O, the XPedite2500 is ideal for user-customizable, high-bandwidth data processing applications.
The XPedite2500 is capable of interfacing to and processing streaming data from a wide variety of inputs. It features up to two x8 PCI Express Gen3 interfaces and up to 8 GB of DDR4 SDRAM available in four 32-bit channels. The x8 PCI Express Gen3 interface on the P16 connector can optionally be replaced with up to eight High-Speed Serial (HSS) ports. LVDS I/O is available via P16, and an optional P14 connector can provide additional LVDS and LVCMOS I/O.
The X-ES FPGA Development Kit (FDK) is provided to support the requirements of high-performance, real-time, embedded, streaming-data applications and simplify FPGA development. X-ES’ FDK includes IP blocks, HDL, test benches, Linux drivers, and complete example designs for the XPedite2500.
Features
AMD (formerly Xilinx) Kintex® UltraScale™ FPGA XCKU115
Conduction- or air-cooled XMC module
Up to 8 GB of DDR4 SDRAM in four 32-bit channels
x8 PCI Express Gen3 interface to P15
x8 PCI Express Gen3 interface or up to eight High-Speed Serial (HSS) ports to P16
19 LVDS to P16
26 LVDS to P14 (optional)
12 LVCMOS (1.8 V) to P14 (optional)
Dual-QSPI FPGA configuration flash
FPGA Development Kit (FDK)
Linux drivers
Technical Specs
FPGA
AMD (formerly Xilinx) Kintex® UltraScale™ for high-performance logic and DSP applications
Standard FPGA is Kintex® UltraScale™ XCKU115
Support for commercial and industrial temperature, as well as -1, -2, -3 speed grades
Memory
Up to 8 GB of DDR4 SDRAM in four 32-bit channels
Dual-QSPI FPGA configuration flash
XMC Site
x8 PCI Express Gen3 interface
P14 User I/O (Optional)
26 LVDS user I/O to FPGA
12 LVCMOS (1.8 V) user I/O to FPGA
P15 I/O
x8 PCI Express Gen3 interface compliant with VITA 42.3
P16 I/O
x8 PCI Express Gen3 interface compliant with VITA 42.3 or up to eight High-Speed Serial (HSS) ports
19 LVDS user I/O to FPGA
Development Support
X-ES FPGA Development Kit (FDK)
Linux drivers
Physical Characteristics
Conduction- or air-cooled XMC form factor
Dimensions: 149 mm x 74 mm
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
Conformal coating available as an ordering option
Power Requirements
Power will vary based on configuration and usage. Please consult factory.
The XPedite2500 is a configurable, high-performance, conduction- or air-cooled XMC module based on the AMD (formerly Xilinx) Kintex® UltraScale™ family of FPGAs. With a range of high-density and high-bandwidth I/O, the XPedite2500 is ideal for user-customizable, high-bandwidth data processing applications.
The XPedite2500 is capable of interfacing to and processing streaming data from a wide variety of inputs. It features up to two x8 PCI Express Gen3 interfaces and up to 8 GB of DDR4 SDRAM available in four 32-bit channels. The x8 PCI Express Gen3 interface on the P16 connector can optionally be replaced with up to eight High-Speed Serial (HSS) ports. LVDS I/O is available via P16, and an optional P14 connector can provide additional LVDS and LVCMOS I/O.
The X-ES FPGA Development Kit (FDK) is provided to support the requirements of high-performance, real-time, embedded, streaming-data applications and simplify FPGA development. X-ES’ FDK includes IP blocks, HDL, test benches, Linux drivers, and complete example designs for the XPedite2500.
Features
- AMD (formerly Xilinx) Kintex® UltraScale™ FPGA XCKU115
- Conduction- or air-cooled XMC module
- Up to 8 GB of DDR4 SDRAM in four 32-bit channels
- x8 PCI Express Gen3 interface to P15
- x8 PCI Express Gen3 interface or up to eight High-Speed Serial (HSS) ports to P16
- 19 LVDS to P16
- 26 LVDS to P14 (optional)
- 12 LVCMOS (1.8 V) to P14 (optional)
- Dual-QSPI FPGA configuration flash
- FPGA Development Kit (FDK)
- Linux drivers
Technical Specs
FPGA
- AMD (formerly Xilinx) Kintex® UltraScale™ for high-performance logic and DSP applications
- Standard FPGA is Kintex® UltraScale™ XCKU115
- Support for commercial and industrial temperature, as well as -1, -2, -3 speed grades
Memory
- Up to 8 GB of DDR4 SDRAM in four 32-bit channels
- Dual-QSPI FPGA configuration flash
XMC Site
- x8 PCI Express Gen3 interface
P14 User I/O (Optional)
- 26 LVDS user I/O to FPGA
- 12 LVCMOS (1.8 V) user I/O to FPGA
P15 I/O
- x8 PCI Express Gen3 interface compliant with VITA 42.3
P16 I/O
- x8 PCI Express Gen3 interface compliant with VITA 42.3 or up to eight High-Speed Serial (HSS) ports
- 19 LVDS user I/O to FPGA
Development Support
- X-ES FPGA Development Kit (FDK)
- Linux drivers
Physical Characteristics
- Conduction- or air-cooled XMC form factor
- Dimensions: 149 mm x 74 mm
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
- Conformal coating available as an ordering option
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.