Extreme Engineering Solutions, Inc. (X-ES) AMD (formerly Xilinx) Kintex® UltraScale™ FPGA-Based Conduction- or Air-Cooled XMC Module XPedite2500

Description
The XPedite2500 is a configurable, high-performance, conduction- or air-cooled XMC module based on the AMD (formerly Xilinx) Kintex® UltraScale™ family of FPGAs. With a range of high-density and high-bandwidth I/O, the XPedite2500 is ideal for user-customizable, high-bandwidth data processing applications. The XPedite2500 is capable of interfacing to and processing streaming data from a wide variety of inputs. It features up to two x8 PCI Express Gen3 interfaces and up to 8 GB of DDR4 SDRAM available in four 32-bit channels. The x8 PCI Express Gen3 interface on the P16 connector can optionally be replaced with up to eight High-Speed Serial (HSS) ports. LVDS I/O is available via P16, and an optional P14 connector can provide additional LVDS and LVCMOS I/O. The X-ES FPGA Development Kit (FDK) is provided to support the requirements of high-performance, real-time, embedded, streaming-data applications and simplify FPGA development. X-ES’ FDK includes IP blocks, HDL, test benches, Linux drivers, and complete example designs for the XPedite2500. Features AMD (formerly Xilinx) Kintex® UltraScale™ FPGA XCKU115 Conduction- or air-cooled XMC module Up to 8 GB of DDR4 SDRAM in four 32-bit channels x8 PCI Express Gen3 interface to P15 x8 PCI Express Gen3 interface or up to eight High-Speed Serial (HSS) ports to P16 19 LVDS to P16 26 LVDS to P14 (optional) 12 LVCMOS (1.8 V) to P14 (optional) Dual-QSPI FPGA configuration flash FPGA Development Kit (FDK) Linux drivers Technical Specs FPGA AMD (formerly Xilinx) Kintex® UltraScale™ for high-performance logic and DSP applications Standard FPGA is Kintex® UltraScale™ XCKU115 Support for commercial and industrial temperature, as well as -1, -2, -3 speed grades Memory Up to 8 GB of DDR4 SDRAM in four 32-bit channels Dual-QSPI FPGA configuration flash XMC Site x8 PCI Express Gen3 interface P14 User I/O (Optional) 26 LVDS user I/O to FPGA 12 LVCMOS (1.8 V) user I/O to FPGA P15 I/O x8 PCI Express Gen3 interface compliant with VITA 42.3 P16 I/O x8 PCI Express Gen3 interface compliant with VITA 42.3 or up to eight High-Speed Serial (HSS) ports 19 LVDS user I/O to FPGA Development Support X-ES FPGA Development Kit (FDK) Linux drivers Physical Characteristics Conduction- or air-cooled XMC form factor Dimensions: 149 mm x 74 mm Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements. Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5 Conformal coating available as an ordering option Power Requirements Power will vary based on configuration and usage. Please consult factory.
Datasheet
Description
The XPedite2500 is a configurable, high-performance, conduction- or air-cooled XMC module based on the AMD (formerly Xilinx) Kintex® UltraScale™ family of FPGAs. With a range of high-density and high-bandwidth I/O, the XPedite2500 is ideal for user-customizable, high-bandwidth data processing applications. The XPedite2500 is capable of interfacing to and processing streaming data from a wide variety of inputs. It features up to two x8 PCI Express Gen3 interfaces and up to 8 GB of DDR4 SDRAM available in four 32-bit channels. The x8 PCI Express Gen3 interface on the P16 connector can optionally be replaced with up to eight High-Speed Serial (HSS) ports. LVDS I/O is available via P16, and an optional P14 connector can provide additional LVDS and LVCMOS I/O. The X-ES FPGA Development Kit (FDK) is provided to support the requirements of high-performance, real-time, embedded, streaming-data applications and simplify FPGA development. X-ES’ FDK includes IP blocks, HDL, test benches, Linux drivers, and complete example designs for the XPedite2500. Features AMD (formerly Xilinx) Kintex® UltraScale™ FPGA XCKU115 Conduction- or air-cooled XMC module Up to 8 GB of DDR4 SDRAM in four 32-bit channels x8 PCI Express Gen3 interface to P15 x8 PCI Express Gen3 interface or up to eight High-Speed Serial (HSS) ports to P16 19 LVDS to P16 26 LVDS to P14 (optional) 12 LVCMOS (1.8 V) to P14 (optional) Dual-QSPI FPGA configuration flash FPGA Development Kit (FDK) Linux drivers Technical Specs FPGA AMD (formerly Xilinx) Kintex® UltraScale™ for high-performance logic and DSP applications Standard FPGA is Kintex® UltraScale™ XCKU115 Support for commercial and industrial temperature, as well as -1, -2, -3 speed grades Memory Up to 8 GB of DDR4 SDRAM in four 32-bit channels Dual-QSPI FPGA configuration flash XMC Site x8 PCI Express Gen3 interface P14 User I/O (Optional) 26 LVDS user I/O to FPGA 12 LVCMOS (1.8 V) user I/O to FPGA P15 I/O x8 PCI Express Gen3 interface compliant with VITA 42.3 P16 I/O x8 PCI Express Gen3 interface compliant with VITA 42.3 or up to eight High-Speed Serial (HSS) ports 19 LVDS user I/O to FPGA Development Support X-ES FPGA Development Kit (FDK) Linux drivers Physical Characteristics Conduction- or air-cooled XMC form factor Dimensions: 149 mm x 74 mm Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements. Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5 Conformal coating available as an ordering option Power Requirements Power will vary based on configuration and usage. Please consult factory.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
AMD (formerly Xilinx) Kintex® UltraScale™ FPGA-Based Conduction- or Air-Cooled XMC Module - XPedite2500 - Extreme Engineering Solutions, Inc. (X-ES)
Verona, WI, United States
AMD (formerly Xilinx) Kintex® UltraScale™ FPGA-Based Conduction- or Air-Cooled XMC Module
XPedite2500
AMD (formerly Xilinx) Kintex® UltraScale™ FPGA-Based Conduction- or Air-Cooled XMC Module XPedite2500
The XPedite2500 is a configurable, high-performance, conduction- or air-cooled XMC module based on the AMD (formerly Xilinx) Kintex® UltraScale™ family of FPGAs. With a range of high-density and high-bandwidth I/O, the XPedite2500 is ideal for user-customizable, high-bandwidth data processing applications. The XPedite2500 is capable of interfacing to and processing streaming data from a wide variety of inputs. It features up to two x8 PCI Express Gen3 interfaces and up to 8 GB of DDR4 SDRAM available in four 32-bit channels. The x8 PCI Express Gen3 interface on the P16 connector can optionally be replaced with up to eight High-Speed Serial (HSS) ports. LVDS I/O is available via P16, and an optional P14 connector can provide additional LVDS and LVCMOS I/O. The X-ES FPGA Development Kit (FDK) is provided to support the requirements of high-performance, real-time, embedded, streaming-data applications and simplify FPGA development. X-ES’ FDK includes IP blocks, HDL, test benches, Linux drivers, and complete example designs for the XPedite2500. Features AMD (formerly Xilinx) Kintex® UltraScale™ FPGA XCKU115 Conduction- or air-cooled XMC module Up to 8 GB of DDR4 SDRAM in four 32-bit channels x8 PCI Express Gen3 interface to P15 x8 PCI Express Gen3 interface or up to eight High-Speed Serial (HSS) ports to P16 19 LVDS to P16 26 LVDS to P14 (optional) 12 LVCMOS (1.8 V) to P14 (optional) Dual-QSPI FPGA configuration flash FPGA Development Kit (FDK) Linux drivers Technical Specs FPGA AMD (formerly Xilinx) Kintex® UltraScale™ for high-performance logic and DSP applications Standard FPGA is Kintex® UltraScale™ XCKU115 Support for commercial and industrial temperature, as well as -1, -2, -3 speed grades Memory Up to 8 GB of DDR4 SDRAM in four 32-bit channels Dual-QSPI FPGA configuration flash XMC Site x8 PCI Express Gen3 interface P14 User I/O (Optional) 26 LVDS user I/O to FPGA 12 LVCMOS (1.8 V) user I/O to FPGA P15 I/O x8 PCI Express Gen3 interface compliant with VITA 42.3 P16 I/O x8 PCI Express Gen3 interface compliant with VITA 42.3 or up to eight High-Speed Serial (HSS) ports 19 LVDS user I/O to FPGA Development Support X-ES FPGA Development Kit (FDK) Linux drivers Physical Characteristics Conduction- or air-cooled XMC form factor Dimensions: 149 mm x 74 mm Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements. Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5 Conformal coating available as an ordering option Power Requirements Power will vary based on configuration and usage. Please consult factory.

The XPedite2500 is a configurable, high-performance, conduction- or air-cooled XMC module based on the AMD (formerly Xilinx) Kintex® UltraScale™ family of FPGAs. With a range of high-density and high-bandwidth I/O, the XPedite2500 is ideal for user-customizable, high-bandwidth data processing applications.

The XPedite2500 is capable of interfacing to and processing streaming data from a wide variety of inputs. It features up to two x8 PCI Express Gen3 interfaces and up to 8 GB of DDR4 SDRAM available in four 32-bit channels. The x8 PCI Express Gen3 interface on the P16 connector can optionally be replaced with up to eight High-Speed Serial (HSS) ports. LVDS I/O is available via P16, and an optional P14 connector can provide additional LVDS and LVCMOS I/O.

The X-ES FPGA Development Kit (FDK) is provided to support the requirements of high-performance, real-time, embedded, streaming-data applications and simplify FPGA development. X-ES’ FDK includes IP blocks, HDL, test benches, Linux drivers, and complete example designs for the XPedite2500.


Features

  • AMD (formerly Xilinx) Kintex® UltraScale™ FPGA XCKU115
  • Conduction- or air-cooled XMC module
  • Up to 8 GB of DDR4 SDRAM in four 32-bit channels
  • x8 PCI Express Gen3 interface to P15
  • x8 PCI Express Gen3 interface or up to eight High-Speed Serial (HSS) ports to P16
  • 19 LVDS to P16
  • 26 LVDS to P14 (optional)
  • 12 LVCMOS (1.8 V) to P14 (optional)
  • Dual-QSPI FPGA configuration flash
  • FPGA Development Kit (FDK)
  • Linux drivers

Technical Specs

FPGA

  • AMD (formerly Xilinx) Kintex® UltraScale™ for high-performance logic and DSP applications
  • Standard FPGA is Kintex® UltraScale™ XCKU115
  • Support for commercial and industrial temperature, as well as -1, -2, -3 speed grades

Memory

  • Up to 8 GB of DDR4 SDRAM in four 32-bit channels
  • Dual-QSPI FPGA configuration flash

XMC Site

  • x8 PCI Express Gen3 interface

P14 User I/O (Optional)

  • 26 LVDS user I/O to FPGA
  • 12 LVCMOS (1.8 V) user I/O to FPGA

P15 I/O

  • x8 PCI Express Gen3 interface compliant with VITA 42.3

P16 I/O

  • x8 PCI Express Gen3 interface compliant with VITA 42.3 or up to eight High-Speed Serial (HSS) ports
  • 19 LVDS user I/O to FPGA

Development Support

  • X-ES FPGA Development Kit (FDK)
  • Linux drivers

Physical Characteristics

  • Conduction- or air-cooled XMC form factor
  • Dimensions: 149 mm x 74 mm

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 3, 5
  • Conformal coating available as an ordering option

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.
Supplier's Site Datasheet

Technical Specifications

  Extreme Engineering Solutions, Inc. (X-ES)
Product Category PMC and XMC Modules
Product Number XPedite2500
Product Name AMD (formerly Xilinx) Kintex® UltraScale™ FPGA-Based Conduction- or Air-Cooled XMC Module
Technology XMC
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