Electroless copper plating process that deposits electroless copper with stellar physical properties.
Product Overview
The Systek SAP copper metallization process is a high-performance semi-additive primary metallization for IC substrates, featuring multiple process improvements. The system is specifically designed as a metallization seed layer for unclad build-up substrates and is composed of a complete line of process chemistry, including desmear, conditioning, activation, and metallization processes. To complete the build-up process, Systek SAP is compatible with Systek’s advanced 2-in-1 plating technology, allowing simultaneous filling of copper microvias and plating of traces. The combined process improvements of Systek SAP enable very high-density circuitry with minimal substrate roughening, enhancing layer performance and reliability.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | Systek ™ SAP Copper |
| Chemical / Composition | Copper Plating |
