MacDermid Alpha Electronics Solutions MICROFAB ® AU660

MICROFAB AU660 enables a single solution for backside interconnect (via liner) and fine pitch pattern gold bumping. It excels at high plating rates (> 0.5µm /min) and step coverage (~2X vs. conventional Gold plating) enabling field thinning that can result in lower cost of ownership. Product Overview MICROFAB AU660 is a mild alkaline non-cyanide gold electroplating process that produces deposits of 99.99% purity. MICROFAB AU660 is frequently used in bump plating on metalized silicon wafers. Features High speed gold deposition Superior step coverage Uniform post gold seed etch