MacDermid Alpha Electronics Solutions MICROFAB ® AU660

Mild alkaline non-cyanide gold electroplating process for backside interconnects (via liners) and fine pitch pattern gold bumping. Product Overview MICROFAB AU660 is a high-purity (99.99%) gold electroplating process frequently used in bump plating on metallized silicon wafers. Designed for backside interconnect (via liner) and fine-pitch pattern gold bumping, it delivers high plating rates (>0.5 µm/min) and approximately twice the step coverage of conventional gold plating, enabling field thinning and reducing cost of ownership.