MacDermid Alpha Electronics Solutions Direct Metallization Solutions for PCBs Shadow ®

Description
Product Overview Shadow is an eco-friendly, graphite-based direct metallization process that makes through holes and blind vias extraordinarily conductive for copper electroplating. Its exceptional coating ability is well recognized in applications on flexible and rigid-flex, PTFE, and exotic materials like Liquid Crystal Polymer (LCP) and hydrocarbons. Shadow is an ideal choice for today’s advanced materials and High-Density Interconnect (HDI) and Modified Semi-Additive Process (mSAP) designs.
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Description
Product Overview Shadow is an eco-friendly, graphite-based direct metallization process that makes through holes and blind vias extraordinarily conductive for copper electroplating. Its exceptional coating ability is well recognized in applications on flexible and rigid-flex, PTFE, and exotic materials like Liquid Crystal Polymer (LCP) and hydrocarbons. Shadow is an ideal choice for today’s advanced materials and High-Density Interconnect (HDI) and Modified Semi-Additive Process (mSAP) designs.
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Direct Metallization Solutions for PCBs - Shadow ® - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Direct Metallization Solutions for PCBs
Shadow ®
Direct Metallization Solutions for PCBs Shadow ®
Product Overview Shadow is an eco-friendly, graphite-based direct metallization process that makes through holes and blind vias extraordinarily conductive for copper electroplating. Its exceptional coating ability is well recognized in applications on flexible and rigid-flex, PTFE, and exotic materials like Liquid Crystal Polymer (LCP) and hydrocarbons. Shadow is an ideal choice for today’s advanced materials and High-Density Interconnect (HDI) and Modified Semi-Additive Process (mSAP) designs.

Product Overview

Shadow is an eco-friendly, graphite-based direct metallization process that makes through holes and blind vias extraordinarily conductive for copper electroplating. Its exceptional coating ability is well recognized in applications on flexible and rigid-flex, PTFE, and exotic materials like Liquid Crystal Polymer (LCP) and hydrocarbons. Shadow is an ideal choice for today’s advanced materials and High-Density Interconnect (HDI) and Modified Semi-Additive Process (mSAP) designs.

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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Number Shadow ®
Product Name Direct Metallization Solutions for PCBs
Chemical / Composition Tin Plating; Electroless
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