MacDermid Alpha Electronics Solutions Wafer Bumping Metallization solutions for Semiconductor Packaging MICROFAB ® Pure BP

Description
Product Overview MICROFAB Pure BP is a high-Kirkendall Void (KV) resistance pure copper process designed for copper pillars without requiring a Ni barrier between the pillar and solder cap. It offers exceptional uniformity within-die and within-feature, along with high purity.
Request a Quote
Description
Product Overview MICROFAB Pure BP is a high-Kirkendall Void (KV) resistance pure copper process designed for copper pillars without requiring a Ni barrier between the pillar and solder cap. It offers exceptional uniformity within-die and within-feature, along with high purity.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Wafer Bumping Metallization solutions for Semiconductor Packaging - MICROFAB ® Pure BP - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Wafer Bumping Metallization solutions for Semiconductor Packaging
MICROFAB ® Pure BP
Wafer Bumping Metallization solutions for Semiconductor Packaging MICROFAB ® Pure BP
Product Overview MICROFAB Pure BP is a high-Kirkendall Void (KV) resistance pure copper process designed for copper pillars without requiring a Ni barrier between the pillar and solder cap. It offers exceptional uniformity within-die and within-feature, along with high purity.

Product Overview

MICROFAB Pure BP is a high-Kirkendall Void (KV) resistance pure copper process designed for copper pillars without requiring a Ni barrier between the pillar and solder cap. It offers exceptional uniformity within-die and within-feature, along with high purity.

Supplier's Site

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Number MICROFAB ® Pure BP
Product Name Wafer Bumping Metallization solutions for Semiconductor Packaging
Chemical / Composition Hard Nickel Plating; Tin Plating; Soft / High Purity
Unlock Full Specs
to access all available technical data

Similar Products

Wafer Bumping Metallization solutions for Semiconductor Packaging - MICROFAB ® SC - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Copper Plating; Hard Nickel Plating; Tin Plating
View Details
Electronic Connector Plating Processes - Nickel-Phosporus Alloy - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Hard Nickel Plating; Tin Plating
View Details
Redistribution Layer for Wafer Level Packaging - BDT-510 - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Tin Plating; Soft / High Purity
View Details
Wafer Bumping Metallization solutions for Semiconductor Packaging - MICROFAB ® CUMSA100 - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Hard Nickel Plating; Tin Plating; Soft / High Purity
View Details