MacDermid Alpha Electronics Solutions MICROFAB ® SC-32

Copper plating process for copper pillar in flip chip package, copper microbump as well as redistribution layer. The process delivers accurate bump height uniformity and bump shape control with higher plating rates than MICROFAB SC. Product Overview The MICROFAB SC-32 acid copper plating formulation provides excellent throwing power, improved leveling characteristics, and ductile low stress deposits. Features Good coplanarity Versatility Ease-of-use