MacDermid Alpha Electronics Solutions MICROFAB ® SC-32

Description
Acid copper plating process offers excellent throwing power, improved leveling characteristics, and ductile, low-stress deposits. Product Overview The MICROFAB SC-32 acid copper plating process is designed for copper pillars in flip chip packages, copper microbumps, and redistribution layers. It delivers accurate bump height uniformity and shape control, with higher plating rates compared to MICROFAB SC.
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Description
Acid copper plating process offers excellent throwing power, improved leveling characteristics, and ductile, low-stress deposits. Product Overview The MICROFAB SC-32 acid copper plating process is designed for copper pillars in flip chip packages, copper microbumps, and redistribution layers. It delivers accurate bump height uniformity and shape control, with higher plating rates compared to MICROFAB SC.
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Suppliers

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MICROFAB ® SC-32 -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
MICROFAB ® SC-32
MICROFAB ® SC-32
Acid copper plating process offers excellent throwing power, improved leveling characteristics, and ductile, low-stress deposits. Product Overview The MICROFAB SC-32 acid copper plating process is designed for copper pillars in flip chip packages, copper microbumps, and redistribution layers. It delivers accurate bump height uniformity and shape control, with higher plating rates compared to MICROFAB SC.

Acid copper plating process offers excellent throwing power, improved leveling characteristics, and ductile, low-stress deposits.

Product Overview

The MICROFAB SC-32 acid copper plating process is designed for copper pillars in flip chip packages, copper microbumps, and redistribution layers. It delivers accurate bump height uniformity and shape control, with higher plating rates compared to MICROFAB SC.

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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Plating Chemicals and Anodizing Chemicals
Product Name MICROFAB ® SC-32
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