MacDermid Alpha Electronics Solutions MICROFAB ® GSW-200

MICROFAB GSW-200 is a mid-purity plating system that can be used with or without a Ni barrier. The solutions ability to level the pad reduces the amount of solder needed leading to a lower cost of ownership. Product Overview The MICROFAB GSW-200 copper process is a unique acid copper plating system designed for filling blind vias across a variety of geometries. The process produces a bright, fine grained, ductile deposit with excellent physical properties. The process enables complete via filling while minimizing surface deposition, reducing cycle time and eliminating the need for planarization. This MICROFAB GSW-200 Copper Process enables the use of stacked via constructions as well as increasing reliability for via-in-pad designs. Features Excellent bottom up fill Flat bump shape