MacDermid Alpha Electronics Solutions Electrolytic Copper Through Hole Plating

Our high throw DC and pulse plating coppers can metallize through holes of nearly any aspect ratio with excellent microdistribution and minimal copper surface plating. Product Overview MacDermid Alpha Electronics Solutions offers a variety of through hole metallization processes from our MacDermid Enthone brand to accommodate any challenge. Our high throw direct current offerings include the HiSpec 2, MacuSpec™ HT series, and CUPROSTAR® ST-2000 processes. Our pulse plating offerings include the MacuSpec PPR, MPR, and PC 600 series processes. Our processes are production proven and offer solutions for the metallization of the most advanced high aspect ratio boards. Product Features High throw DC portfolio enables pulse-like plating in DC equipment MacuSpec HT series DC baths offer throwing power of greater than 80% at 30 ASF Pulse plating portfolio offers superior microdistribution with wide operating windows Industry recognized pulse baths including MacuSpec PPR, MPR, and PC 600