Acid copper plating system designed for simultaneous plating of RDL lines and via filling across a wide range of geometries.
Product Overview
The MICROFAB RDLV 50, 60, and 70 processes are acid copper plating systems designed for simultaneous plating of RDL lines and filling of vias across a wide range of line, space, and via dimensions. These products are formulated to achieve bottom-up via filling while maintaining a flat line profile with excellent uniformity.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | MICROFAB ® RDLV Series |
