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Wafer Level Packaging (WLP) continues to demand high yield, high performance packages, MacDermid Alpha's barrier technology is leading the way.
Product Overview
MICROFAB NI-200 is a sulfamate nickel electroplating process that produces a pure, ductile, fine-grained, low stress nickel deposit required to meet the needs of the semiconductor industry for quality assured chemistry.
Features
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | MICROFAB ® NI-200 |