High-dep metallization process combining a patented activation sequence with a statistically designed electroless copper bath.
Product Overview
The M-Copper Omega is a high-deposition metallization process that combines a unique, patented activation sequence with a statistically designed electroless copper bath. The patented activation sequence utilizes nontraditional conditioning and acceleration steps to enhance glass coverage. This enhanced coverage yields superior post-pattern plate backlight performance. The statistically designed electroless copper bath produces the highest reliability on microvias and high aspect ratio holes.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | M-Copper Omega ® |
| Chemical / Composition | Copper Plating; Electroless |
