ALPHA OM-565 is a zero-halogen, low temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175 °C for minimized warpage induced defects and enhanced product reliability compared to existing low temperature solutions.
Product Overview
ALPHA OM-565 HRL3 low temperature solder paste is designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 °C and superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HIP).
The ALPHA OM-565 chemistry enhances electrochemical performance over existing low melt point solders and provides excellent compatibility when used in combination with alternative ALPHA solutions for contact rework applications.
Product Features
Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability.
The HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects.
Low melt point reflow improves energy efficiency and reduces energy costs in the assembly process.
Superior HiP/NWO performance.
Compatibility with contact rework applications.
8-hour stencil life in ambient and elevated conditions.
ALPHA OM-565 is a zero-halogen, low temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175 °C for minimized warpage induced defects and enhanced product reliability compared to existing low temperature solutions.
Product Overview
ALPHA OM-565 HRL3 low temperature solder paste is designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 °C and superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HIP).
The ALPHA OM-565 chemistry enhances electrochemical performance over existing low melt point solders and provides excellent compatibility when used in combination with alternative ALPHA solutions for contact rework applications.
Product Features
- Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability.
- The HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects.
- Low melt point reflow improves energy efficiency and reduces energy costs in the assembly process.
- Superior HiP/NWO performance.
- Compatibility with contact rework applications.
- 8-hour stencil life in ambient and elevated conditions.
