A zero-halogen, low-temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175°C.
Product Overview
ALPHA OM-565 HRL3 low-temperature solder paste is designed to mitigate warpage induced defects in temperature-sensitiv
e chip-scale packages. This solder paste enables peak reflow temperatures of 175°C and offers superior wettability to minimize post-reflow defects, such as non-wet-open (NWO) and head-in-pillow (HIP).
The ALPHA OM-565 chemistry enhances electrochemical performance compared to existing low-melt point solders and provides excellent compatibility when used in combination with alternative ALPHA solutions for contact rework applications.
Compatibility with HRL3 Alloy
Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability.
Enables Peak Reflow Temperature of 175°C
The HRL3 alloy enables a peak reflow temperature of 175°C, effectively mitigating warpage induced defects.
Low Melt Point Reflow
Low melt point reflow improves energy efficiency and reduces energy costs in the assembly process.
Superior HiP/NWO Performance
Compatibility with Contact Rework Applications
8-Hour Stencil Life in Ambient and Elevated Conditions
A zero-halogen, low-temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175°C.
Product Overview
ALPHA OM-565 HRL3 low-temperature solder paste is designed to mitigate warpage induced defects in temperature-sensitive chip-scale packages. This solder paste enables peak reflow temperatures of 175°C and offers superior wettability to minimize post-reflow defects, such as non-wet-open (NWO) and head-in-pillow (HIP).
The ALPHA OM-565 chemistry enhances electrochemical performance compared to existing low-melt point solders and provides excellent compatibility when used in combination with alternative ALPHA solutions for contact rework applications.
Compatibility with HRL3 Alloy
Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability.
Enables Peak Reflow Temperature of 175°C
The HRL3 alloy enables a peak reflow temperature of 175°C, effectively mitigating warpage induced defects.
Low Melt Point Reflow
Low melt point reflow improves energy efficiency and reduces energy costs in the assembly process.
Superior HiP/NWO Performance
Compatibility with Contact Rework Applications
8-Hour Stencil Life in Ambient and Elevated Conditions
