MacDermid Alpha Electronics Solutions ALPHA ® OM-5100 Solder Paste

Low residue, no-clean solder paste designed to maximize first pass yields with a rheologically formulated flux vehicle. Product Overview ALPHA OM-5100 Solder Paste is a low-residue, no-clean solder paste designed to maximize first-pass yields. The ALPHA OM-5100 activation system is optimized to enhance joint solderability and minimize post-reflow soldering defects. This paste's wide reflow profile window enables soldering with lead-free components. ALPHA OM-5100 is engineered for complex assemblies with small (0201) tin-finished passives and ensures solderability with large (1mm pitch) BGA components containing lead-free spheres. Small print deposits remain fully coalesced, even in profiles hot enough to collapse SAC305 BGA spheres. Consistent Fine-Feature Print Volume Repeatability Low Post-Reflow Residue Reduction in Mid-Chip Solder Ball Defects Minimizes Random Solder Balling