Product Overview
ALPHA OM-362 is a lead-free, zero-halogen, no-clean solder paste available in T4 powder. It is specifically designed to deliver ultra-low voiding performance across all component types, with a focus on bottom-terminated components.
ALPHA OM-362 achieves Institute of Printed Circuit Board (IPC) Class III voiding on Ball Grid Array (BGA) components, and less than 10% average voiding on Bottom Terminated Components (BTC). This paste is engineered for ultra-low voiding performance with high-reliability alloys such as Innolot® and traditional Tin-Silver-Copper (SAC) alloys.
Product Features
Ultra-Low Voiding Performance
Excellent Electromigration Characteristics
Good Coalescence and Wetting Performance
Excellent Solder Joint and Flux Residue Cosmetics
Zero-Halogen, No Halogens Intentionally Added
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | ALPHA ® OM-362 Solder Paste |
| Product Name | Solder Paste Materials for Printed Circuit Boards (PCB) |
| Joining Process / Product Form | Braze or solder in the form of a paste.; Powder |
