Product Overview
A high-performance, one-component epoxy adhesive designed for bonding applications in electronics manufacturing. It provides excellent adhesion to a variety of substrates, including metals, ceramics, and plastics, making it versatile for diverse assembly needs. This adhesive cures quickly at low temperatures, minimizing thermal stress on sensitive components and enabling efficient production processes.
Product Features
Fast, Low-Temperature Cure
It cures quickly at low temperatures, making it ideal for heat-sensitive components, ensuring reliability while minimizing thermal stress during assembly.
Halogen-Free and RoHS Compliant
This product meets environmental safety standards, providing a compliant solution for industries requiring eco-friendly materials.
High Adhesion
Suitable for a range of materials, it delivers strong bonding capabilities, even on challenging surfaces like Liquid Crystal Polymer (LCP) and metals.
Featured Applications
Heat-Sensitive
Perfect for electronic components that are sensitive to high-temperature processing, such as those found in computing and communication devices.
Automotive
Used for sensors and modules that require reliable bonding and compliance with automotive-grade standards.
Industrial
Ideal for devices in harsh environments, thanks to its high adhesion and thermal stability.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | ALPHA ® HiTech ® AD13-9521B |
| Product Name | Precision Camera Module Adhesive Solutions |
| Cure / Technology | Single Component |